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Filtering & Frequency Selection•2-Port Filter

High-Pass Filter (Stub / Quasi-Lumped)

Attenuates low-frequency noise and IF feedthrough while passing high microwave bands.

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High-Pass Filter (Stub / Quasi-Lumped) — Photorealistic 3D PCB Hardware Render
NIKOLARF
Insertion Loss
< 0.45 dB in upper microwave passband
Isolation / Return Loss
> 35 dB rejection below cutoff frequency
Bandwidth
High-pass from f_cutoff up to multi-GHz upper limit
Power Rating
Medium (Limited by series capacitor voltage breakdown)

Device Topology & Electromagnetic Behavior

Combines series high-Q capacitors (interdigital fingers or ultra-low-ESR microwave chip caps) with short-circuited shunt transmission line stubs (acting as high-frequency inductors to ground). Blocks sub-GHz interference and DC currents while preserving high-frequency signal integrity.

ANALYTICAL FORMULATIONS & S-MATRIX MAPPING
X_L = Z_stub tan≤ft((2π f ell) / (v_p)) (Shunt Shorted Inductive Stub)
• Short-circuited stub presents low impedance to ground at low frequencies and high impedance at passband.
X_C = (1) / (2π f C_series) to 0 as f to infty
• Series capacitor passes microwave frequencies unimpeded.
Recommended Substrate Stackup

Rogers RO4003C or RT/duroid® 6002 for phase-stable stub lengths.

Nikola RF Fabrication Directives
  • Plated through-hole (PTH) ground vias with low parasitic via-inductance (<0.05 nH).
  • Short stub lengths to suppress spurious re-entrant passbands at harmonic frequencies.
Full-Lifecycle Engineering Services

Design, 3D EM Simulation & Handoff for High-Pass Filter (Stub / Quasi-Lumped)

We provide turnkey synthesis, multi-frequency full-wave simulation, and fabrication-ready packaging for the High-Pass Filter (Stub / Quasi-Lumped).

1. 3D Full-Wave FEM Modeling

Complete Ansys HFSS 3D CAD modeling with true edge-launch SMA or SMP connectors, via fence stitching, and adaptive mesh refinement down to ΔS < 0.007.

2. Sensitivity & Tolerance Sweeps

Monte Carlo statistical analysis over copper etching tolerances (±15 µm) and substrate permittivity variations to guarantee first-pass high-yield manufacturing.

3. Manufacturing Handoff

Delivery of verified simulation models, parameterized layout geometries, and photolithography-compliant Gerber RS-274X fabrication packages.

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Submit your operational frequency, bandwidth, power handling, and target substrate stackup. Our electromagnetic engineers will deliver a verified feasibility audit within 48 hours.

06 • Secure Intake & Bilateral NDA

Initiate Project Scope & NDA

We treat client intellectual property with military-grade rigor. Prior to receiving proprietary disclosure files, patent drafts, or trade secret geometries, we execute standard bilateral NDAs.

Bilateral NDA Standard

Mutual non-disclosure executed before file transmission.

Isolated On-Prem Compute

Simulations run on dedicated air-gapped workstations.

Clean Room Protocol

Full audit trail for IP litigation and patent defense.

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Computational Electromagnetics • Microwave Co-Design • Strict Engineering Confidentiality