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Filtering & Frequency Selection•3-Port (1 Common, 2 Band)

Dual-Channel Diplexer

Splits a broadband feed into two distinct non-overlapping frequency bands.

Dual-Channel Diplexer — Photorealistic 3D PCB Hardware Render
NIKOLARF
Insertion Loss
< 0.8 dB across both active passbands
Isolation / Return Loss
> 35 dB cross-channel isolation between Port 2 and Port 3
Bandwidth
Dual independent passbands
Power Rating
50W+ CW power handling

Device Topology & Electromagnetic Behavior

A 3-port frequency-selective network joining a low-pass (or low-band BPF) channel and a high-pass (or high-band BPF) channel at a common junction. Allows dual-band transmitters (e.g., 2.4 GHz and 5.8 GHz, or Sub-6 GHz and mmWave) to share a single coaxial cable or dual-band antenna with >35 dB cross-band isolation.

ANALYTICAL FORMULATIONS & S-MATRIX MAPPING
Y_common = Y_LowBand + Y_HighBand = Y₀ (Susceptance Annulment Condition)
• Input susceptances of both filter arms cancel out at the junction to maintain 50 Ω match.
Isolation: S₃2 = S₃1 · S₁2 ≈ 0 (Cross-channel suppression)
• Prevents high-band transmitter leakage from desensitizing low-band receiver.
Recommended Substrate Stackup

Rogers RT/duroid® 5880 for minimal passband insertion loss.

Nikola RF Fabrication Directives
  • Impedance-matched junction manifold to prevent standing wave ripple at cross-over frequencies.
  • Comprehensive ground via-fence separation between low-band and high-band filter arms.
Full-Lifecycle Engineering Services

Design, 3D EM Simulation & Handoff for Dual-Channel Diplexer

We provide turnkey synthesis, multi-frequency full-wave simulation, and fabrication-ready packaging for the Dual-Channel Diplexer.

1. 3D Full-Wave FEM Modeling

Complete Ansys HFSS 3D CAD modeling with true edge-launch SMA or SMP connectors, via fence stitching, and adaptive mesh refinement down to ΔS < 0.007.

2. Sensitivity & Tolerance Sweeps

Monte Carlo statistical analysis over copper etching tolerances (±15 µm) and substrate permittivity variations to guarantee first-pass high-yield manufacturing.

3. Manufacturing Handoff

Delivery of verified simulation models, parameterized layout geometries, and photolithography-compliant Gerber RS-274X fabrication packages.

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Submit your operational frequency, bandwidth, power handling, and target substrate stackup. Our electromagnetic engineers will deliver a verified feasibility audit within 48 hours.

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Bilateral NDA Standard

Mutual non-disclosure executed before file transmission.

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Simulations run on dedicated air-gapped workstations.

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Computational Electromagnetics • Microwave Co-Design • Strict Engineering Confidentiality